Description:
- The steel material is strong and high-temperature resistant, making it difficult to deform.
- Precision chip positioning for accurate and better alignment and reballing.
- Features a magnetic platform that allows you to easily and quickly swap out BGA stencils and ensures unmovable reballing work.
- It comes with multiple middle-layer reballing platforms and applies to a wide range of iPhone models, including the iPhone 5-15 Pro Max.
- IC numbers are printed on the stencils for reference to make your soldering job more efficient.
